Overview

Thermal putty, including dispensable materials and pre-formed putty pads, is designed to provide reliable heat transfer in applications with large gap variation and complex assembly tolerances. Its soft, compliant, putty-like consistency enables excellent surface contact and gap-filling performance, helping reduce thermal resistance between heat-generating components and cooling structures. Dispensable thermal putty supports automated application and adapts to both small and large gaps, while putty pads offer controlled thickness, easy handling, natural tackiness, and convenient placement without additional adhesives. Thermal putty delivers high thermal conductivity, low mechanical stress, strong compressibility, and reliable interface contact.

Features

• Excellent gap-filling capability 

• Ultra-soft and low stress 

• Easily handling and reworkability

Applications

• AIDCs and telecoms: Optical modules, routers and servers, power racks 

• Automotives: MCUs, ECUs, LiDAR and ADAS 

• Power Electronics: Power supplies, IGBTs, power modules