Overview 

Thermal potting compounds are designed to provide superior heat dissipation and robust environmental protection for electronic components. They easily flow into complex, small cavities and intricate topographies before curing into a void-free soft elastomer or rigid solid. They can protect delicate components from mechanical and thermal shock with outstanding long-term reliability, provide excellent electrical insulation, moisture resistance, and vibration damping across a wide operating temperature range.

Features

• Excellent flowability for void-free filling of complex, tight spaces 

• Low shrinkage during curing and minimize mechanical stress on delicate components 

• Robust protection against moisture, chemicals and environmental contaminants

Applications

• Automotive electronics: Battery modules, inverters, OBCs 

• Power electronics: Power supplies, transformers, UPS 

• Electromagnetic devices: Motors, coil assemblies, transformers